I've usually seen people apply thermal paste as a small dot in the center or in an X pattern, then let the cooler's mounting pressure spread it. However, videos of mini PCs often show the paste being spread manually with a small spatula. Is that actually better for mini PCs, or is the application method basically the same as on a regular desktop PC?
3 Answers
Amount matters more than the exact pattern. Put on enough to fill the microscopic gaps, then mount the cooler evenly so the pressure spreads it out. Too much paste can make cleanup messier, especially with an X pattern, but a small excess generally gets squeezed out rather than causing a major problem.
The important distinction is whether the chip has an integrated heat spreader. For a bare-die chip, manually spreading the paste can help ensure the entire die is covered. With a normal CPU that has a metal heat spreader, the difference between a pea-sized dot, an X, or spreading it first is usually negligible.
Mini PCs don’t need a special method just because they’re smaller. Use whatever approach makes it easiest to apply a thin, even layer without making a mess. A center dot is simple, while spreading can be useful if you want to guarantee coverage.
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